六六字典>英语词典>dicing翻译和用法

dicing

英 [ˈdaɪsɪŋ]

美 [ˈdaɪsɪŋ]

v.  将(肉、菜等)切成小方块; 将…切成丁
dice的现在分词

计算机

柯林斯词典

  • 骰子;色子
    Adiceis a small cube which has between one and six spots or numbers on its sides, and which is used in games to provide random numbers. In old-fashioned English, 'dice' was used only as a plural form, and the singular wasdie, but now 'dice' is used as both the singular and the plural form.
    1. 掷骰子游戏
      Diceis a game which is played using dice.
      1. VERB 把(食物)切成小块;将…切丁
        If youdicefood, you cut it into small cubes.
        1. Dice the onion...
          把洋葱切成丁。
        2. Add the crushed garlic and remaining diced vegetables.
          加入捣碎的大蒜和剩余的蔬菜丁。

      双语例句

      • This makes slicing and dicing your bytecode easy.
        这使对字节码的切片和切块变得容易。
      • In OLAP processing, slicing and dicing is often performed along a time axis to analyze trends and find time-based patterns in the data.
        在OLAP的加工,切片和切割往往是演出沿着时间轴来分析发展趋势,并抽出时间为基础的模式中的数据。
      • Design and Implementation of Primary and Secondary Schools Admission Dicing System Based on Proximity Principle
        基于就近原则的中小学招生划片系统设计与实现
      • Freddy Krueger plays the vengeful monster who kills by slicing, dicing and chopping people who had murdered him.
        弗雷迪·克***扮演一个复仇的魔鬼,他把那些杀害他的人一一肢解至死。
      • Just like tags for requirements, categories of your test cases can be invaluable for slicing and dicing your testing data so that you can determine what's really happening.
        就像对于需求的标签一样,测试用例的范畴对于切割测试数据以便决定到底发生了什么来说是无价的。
      • Experimental Research on Improving Properties of Composite Electroplated Diamond Dicing Blade
        提高复合电沉积金刚石切割片性能的试验研究
      • A lady doesn't crawl around on the decks dicing with the crew.
        高贵女士可不会和船员们在船的甲板上来回爬。
      • Upon the installation of a multi beam laser dicing system, the obviously advantages of using such a laser dicing process become evident.
        基于已经安装的多光束激光划片系统,其显著的优点已经得到证实。
      • We are dicing for drinks.
        我们在掷骰子赌喝酒。
      • After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
        通过对半导体加工工艺的分析研究,提出了用磨料水射流切割半导体材料,包括晶圆的切割、芯片的终端封装切割。